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ADI晶圓化合物半導(dǎo)體材料

發(fā)布時(shí)間：2021-03-18 17:13:47 瀏覽：1721

ADI晶圓的制取包括襯底制取和外延性工藝。襯底是由半導(dǎo)體材料單晶材料制作而成的晶片。該基板可直接進(jìn)入晶圓制造流程以生產(chǎn)制造半導(dǎo)體元器件或外延性晶圓。外延性是指在單晶襯底上生長(zhǎng)一層新單晶的流程。ADI新的單晶能夠是與襯底相同的材料，還可以是有所不同的材料。外延性能夠產(chǎn)生越來(lái)越多種類的材料，使元器件設(shè)計(jì)有越來(lái)越多的選擇。

襯底制取的基礎(chǔ)步驟如下：首先，對(duì)半導(dǎo)體材料多晶材料進(jìn)行提煉、摻雜和拉伸，獲得單晶材料。以硅為例子，先將硅砂精煉、復(fù)原為純度98%左右的冶金工業(yè)級(jí)粗硅，再通過(guò)多次提煉，獲得電子級(jí)高純度多晶硅，再經(jīng)爐拉獲得單晶硅棒。通過(guò)機(jī)械加工、化學(xué)處理、表面拋光和質(zhì)量檢測(cè)，獲得了滿足一定標(biāo)準(zhǔn)的單晶拋光片。拋光的目的是更進(jìn)一步去除加工表面上的殘余損傷層。綜上所述拋光片可直接適用于制造元器件，也可用作外延性的襯底材料。

深圳市立維創(chuàng)展科技有限公司，優(yōu)勢(shì)渠道提供ADI晶圓產(chǎn)品華夫格，專業(yè)通道，歡迎合作。

詳情了解ADI Wafer產(chǎn)品請(qǐng)點(diǎn)擊： http ： //11shops.com/public/brand/68.html

或聯(lián)系我們的銷售工程師： 0755- 83642657 QQ ： 2295048674

ADI芯片.jpg

Generic	Material	Description	Order Qty	Package Option	Category
ADA4841-2	ADA4841-2KGD-WP	Dual Low Power Low Noise Rail-Rail OpAmp	Contact ADI	WAFFLEPACK	Amplifiers
ADA4870	ADA4870-KGD-WP	Single Channel High Speed, 1A Output	Contact ADI	WAFFLEPACK	Amplifiers
ADA4870	ADA4870-KGD-DF	Single Channel High Speed, 1A Output	Contact ADI	FILMFRAME	Amplifiers
ADN2820	ADN2820ACHIPS	10Gbps Tranimpedance Amplifier	Contact ADI	WAFFLEPACK	Amplifiers
ADN2880	ADN2880ACHIPS	2.7Gbps Transimpedance Amplifier IC.	Contact ADI	WAFFLEPACK	Amplifiers
OP27	OP27NBC	9/30V, BIP, OP, Low Noise, Low Dr	Contact ADI	WAFFLEPACK	Amplifiers
OP284	OP284CHIPS	3/30V, BIP, OP, Low Noise, RRIO, 2X	Contact ADI	WAFFLEPACK	Amplifiers
OP37	OP37NBC	9/30V, BIP, OP, Low Noise, Avo >-5, 1X	Contact ADI	WAFFLEPACK	Amplifiers
OP37	OP37-001C	9/30V, BIP, OP, Low Noise, Avo >-5, 1X	Contact ADI	FILMFRAME	Amplifiers
OP400	OP400GBC	6/30V, BIP, OP, Low Vos, Low Isy, 4X	Contact ADI	WAFFLEPACK	Amplifiers
OP42	OP42NBC	Fast Settling Precision op amp	Contact ADI	WAFFLEPACK	Amplifiers
OP467	OP467GBC	Quad Precision, High Speed Op Amp	Contact ADI	WAFFLEPACK	Amplifiers
OP77	OP77NBC	6/30V, BIP, OP, Low Vos, Precision, 1X	Contact ADI	WAFFLEPACK	Amplifiers
OP77	OP77-001C	6/30V, BIP, OP, Low Vos, Precision, 1X	Contact ADI	FILMFRAME	Amplifiers
HMC-ALH102G	HMC-ALH102	GaAs HEMT WBand lo Noise amp, 2 - 20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-ALH102G	HMC-ALH102-SX	GaAs HEMT WBand lo Noise amp, 2 - 20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-ALH482G	HMC-ALH482	GaAs HEMT WBand lo Noise amp, 2 - 22 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-ALH482G	HMC-ALH482-SX	GaAs HEMT WBand lo Noise amp, 2 - 22 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-AUH232G	HMC-AUH232	GaAs HEMT WBand Driver amp, DC - 43 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-AUH249G	HMC-AUH249	GaAs HEMT WBand Driver amp, DC - 35 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC-AUH312G	HMC-AUH312	GaAs HEMT WBand Driver amp, DC - 65 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC460G	HMC460	WBand lo Noise amp Chip, DC - 20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC460G	HMC460-SX	amp, lo Noise, DC-20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC462G	HMC462	low Noise amp Chip, 2 - 20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC462G	HMC462-SX	I.C., 2-20 GHz WBand LNA Die	Contact ADI	GEL_PACK	Amplifiers
HMC463G	HMC463	low Noise amp Chip w/AGC, 2-20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC463G	HMC463-SX	I.C., 2-20GHz LNA Die	Contact ADI	GEL_PACK	Amplifiers
HMC465G	HMC465	WBand Driver amp Chip, DC - 20 GHz	Contact ADI	GEL_PACK	Amplifiers
HMC465G	HMC465-SX	I.C., DC-20GHz PA Die	Contact ADI	GEL_PACK	Amplifiers
HMC562G	HMC562	WBand Driver amp Chip, 2 - 35 GHz	Contact ADI	GEL_PACK	Amplifiers

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